Export Citation

Export to :

Citation :

Langauge:
Style:
Kim, Hye-Rim, Shin, Sang-Yong, Choi, Min-Ho, Ahn, Byung-Lip, Sung, Uk-Joo. (2019). Thermal Property Test for Thermal Bridges of Window-Wall Package Envelope. Journal of Korean Institute of Architectural Sustainable Environment and Building Systems, 13(4), 223-233. doi:10.22696/jkiaebs.20190019